Drop test analysis of ball grid array package using finite element method
نویسندگان
چکیده
منابع مشابه
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ژورنال
عنوان ژورنال: IOP Conference Series: Materials Science and Engineering
سال: 2021
ISSN: 1757-8981,1757-899X
DOI: 10.1088/1757-899x/1109/1/012023